Call for paper

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium
December 2-4, 2009 (Wednesday ~ Friday), Hong Kong / China

Important Deadlines and Dates:
Print-ready 4-page Full Paper Submission (up to 4 pages in PDF format only)	15 September 2009
Paper Acceptance Notification	15 October 2009
Advanced Program Available on Website	31 October 2009


	Download Call for Paper !!


	For inquiries, please email to edaps2009@ee.cuhk.edu.hk

	Upcoming News : *Tutorial Schedule !! *Registration !!

The 2009 EDAPS Symposium :

The Electrical Design of Advanced Packaging & Systems (EDAPS) has been the premier international signal integrity symposium in Asia region since 2002. The symposium consists of paper presentations, industry exhibitions, workshops and tutorials. The 2009 EDAPS will be jointly organized by The Chinese University of Hong Kong, Applied Science and Technology Research Institute (ASTRI), Innovation and Technology Commission of Hong Kong SAR Government and the IEEE Components, Packaging and Manufacturing Technology Society (CPMT).
The purpose of EDPAS Symposium is to enhance the technical awareness and technology collaborations in the Asia region specifically in the electrical designs of chip, package and system levels from design concepts, technical challenges to the modeling and EDA tools. The papers of the symposium not only address the current technical issues but also bring out the challenges facing to IC design, SiP/SoP packaging, EMI/EMC, and EDA tools. The symposium is a major venue for creating the opportunity for the researchers and practitioners from the diverse fields to exchange information and build up the network.

Venue

The 2009 EDAPS will be held in the spectacular campus of The Chinese University of Hong Kong from December 3-4, 2009. In order to promote the state-of-the-art technologies to the electronics-related industries in China, a one-day-long session consisting of technical tutorials and workshops will be held in Shenzhen, China on December 2.

Key Topics of the 2009 EDAPS:

Signal integrity topics including High-speed Digital Signal Integrity Modeling, Design, and Measurement;
Power Distribution Network;
System in Package (SiP)/System on Package (SoP) Design;
High-performance Packaging for System on Chip (SoC);
RF/Microwave Packaging for Wireless Communication and Mobile Phone;
Interconnect Modeling, Simulation, and Measurement;
Embedded Passives Modeling and Measurement;
High-speed Channels Modeling and Measurement;
EMI/EMC and Electromagnetic Modeling and Measurement;
EDA Tools for Chip, Package, and Board Co-design and Simulation.

Symposium Program:
Tutorials:	2 December 2009
Plenary speeches:	3 December 2009
Oral presentations:	3-4 December 2009
Poster presentations:	3-4 December 2009
Exhibition:	3-4 December 2009
Banquet:	3 December 2009

Committee Memberes

Organizing Committee

Symposium Chair

Prof. Ke-Li Wu
(The Chinese University of Hong Kong)

klwu@ee.cuhk.edu.hk

Symposium Co-Chair

Prof. Erping Li
(National University of Singapore)

elelep@nus.edu.sg

Technical Program Chair

Dr. Tom Chung
(Hong Kong Applied Science and Technology Research Institute Company Limited)

tomchung@astri.org

Local Organizing Committee Chair

Dr. Lap Wai, Lydia, Leung
(Hong Kong Applied Science and Technology Research Institute Company Limited)

lydialeung@astri.org

Local Arrangement Chair

Prof. Kwok Keung, Michael, Cheng
(The Chinese University of Hong Kong)

kkcheng@ee.cuhk.edu.hk

Local Arrangement Co-Chair

Dr. Man Lung, Ivan, Sham
(Hong Kong Applied Science and Technology Research Institute Company Limited)

ivansham@astri.org

Symposium Advisory Chair

Dr. Hui-li Fu
(Huawei)

hlfu@huawei.com

Symposium Secretary

Kit-Sze, Ivy, Lam
(The Chinese University of Hong Kong)

edaps2009@ee.cuhk.edu.hk

Technical Support Officer

Yun-Ming, Leo, Fung
(The Chinese University of Hong Kong)

ymfung@ee.cuhk.edu.hk