Time

Session

Session Chair / Speaker

08:30 - 17:00

Registration

09:00 - 10:30

Modeling I

Prof. Weng Cho Chew (HKU)

10:15 - 11:15

Poster Session II

Prof. Wen-Yan Yin (ZJU)

11:15 - 12:45

Modeling II

Prof. Tie Jun Cui (SEU)

12:45 - 13:45

Lunch

13:45 - 15:15

Embedded Passives

Prof. Ruey-Beei Wu

15:15 - 16:45

Packaging

Dr. Hui-li Fu

17:15 - 21:30

Official Tour

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Power Integrity

Session Chair: Prof. Joungho Kim (KAIST)

Time

Paper Title & Authors

10:40 - 11:10

Invited Paper

#29: A Parallel Framework for Transient Power Integrity
Analysis

Harjot Dhindsa, Natalie Nakhla, Ramachandra Achar, Michel Nakhla, Douglas Paul and Arvind Sridhar (Carleton University)

11:10 - 11:25

#36: Closed-form expression of self/mutual power-bus impedances in a finite circular plate pair

¹Yao-Jiang Zhang, ¹Er-Ping Li, ² Jun Fan (¹Institute of High Performance Computing, ²Missouri University of Science and Technology)

11:25 - 11:40

#37: Power Distribution Network Co-simulation for Cost-effective System Design

¹Jimmy Hsu, ²Jack Lin, ¹Tung-Yang Chen, ¹Wei-Sa Guo, ¹Sam Yang, ¹Renee Lee (¹Himax Technologies, Inc., ²Sigrity Inc.)

11:40 - 11:55

#45: Modeling and Analysis of Electromagnetic Bandgap Structures on Power Distribution Network

Sang-Gyu Kim, Hyun Kim, Hee-do Kang, Jong-Gwan Yook (Yonsei University)

11:55 - 12:10

#97: IRDrop Analysis in Power Delivery Networks Design

Weliang Dai (Cadence Design Systems, Inc.)

Signal Integrity I

Session Chair: Prof. Madhavan Swaminathan (GaTech)

Time

Paper Title & Authors

13:30 - 14:00

Invited Paper

#28: Multi-Physics Characterization of Through Silicon Vias (TSV) in the Presence of a Periodic EMP

Xiao-Peng Wang, Wen-Yan Yin (Zhejiang University)

14:00 - 14:15

#26: Extended Analysis of SSN Effect on Phase-Locked Loop (PLL) Circuit

Joseph Kho Boon Hock, Chooi Ian Loh, Wui Hung Moo, Chee Seong Fong, Man On Wong (Altera Corporation)

14:15 - 14:30

#43: Near Zero SSN Power Delivery Networks Using Constant Voltage Power Transmission Lines

Suzanne Huh, Daehyun Chung, Madhavan Swaminathan (Georgia Institute of Technology)

14:30 - 14:45

#44: A Novel Power Plane Topology for Wideband Suppression of Simultaneous Switching Noise and Fast Computational Method

Hee-do Kang, Hyun Kim, Sang-Gyu Kim, Jong-Gwan Yook (Yonsei University)

14:45 - 15:00

#46: Experiment and Simulation of Power Supply Switching Current Dependency on the On-chip Capacitance

¹Kozo Hoshino, ¹Ryuuki Satomi, ¹Toshio Sudo, Hirokazu Okano, ²Miyuki Ishikawa, ²Hiroyuki Shibayama, ²Hiroshi Aoyagi, ²Hidefumi Kushibe, ²Kunihiko Yamagishi (¹Shibaura Institute of Technology, ²Toshiba Corporation)

Signal Integrity II

Session Chair: Prof. Ram Achar (Carleton Univ.)

Time

Paper Title & Authors

15:45 - 16:15

Invited Paper

#19: Signal/Power Integrity Design Strategy for Low-Cost Package of High-Speed Memory I/O Interfaces

¹Hao-Hsiang Chuang, ¹Chih-Jung Hsu, ²Ming-Zhang Hong, ²Darren Hsu, ²Raphael huang, ²Li Chang Hsiao, ¹Tzong-Lin Wu (¹National Taiwan University, ²Nanya Technology Corp.)

16:15 -16:30

#10: Signal Quality Test with 3-Dimensional BER Opening for Non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP)

Changwook Yoon, Jiseong Kim, Joungho Kim (KAIST)

16:30 - 16:45

#25: An Enhanced High-Precision and Time-Saving Jitter Transfer Measurement

Joseph Kho, Siew Goh Lim, Yih Ling Tan, Esther Cheng, Man On Wong (Altera Corp.)

16:45 - 17:00

#48: A fast and precise eye-diagram estimation method for a channel of a pair of differential microstrip lines on PCB with arbitrary terminations

Jeonghyeon Cho, Eakhwan Song, Jongjoo Shim, Yujeong Shim, Joungho Kim (KAIST)

17:00 - 17:15

#59: Signal Integrity Analysis of High Speed USB IO and Interconnection

Tinghou Chen, Pinghua Luo, Huili Fu (Huawei Technologies (Hisilicon) Co. Ltd.)

Modeling I

Session Chair: Prof. Weng Cho Chew (HKU)

Time

Paper Title & Authors

09:00 - 09:30

Invited Paper

#53: GEMS: A High Performance EM Simulation Tool

Wenhua Yu (2COMU)

09:30 - 09:45

#32: Fast Simulation of Power Distribution Networks Based on Semi-Implicit Numerical Integration Method and RLCG-MNA Formulation

Tomoki Ishimaru, Tadatoshi Sekine, Hideki Asai (Shizuoka University)

09:45 - 10:00

#33: A Novel On-chip Fractal Power Tree Network Based on Leaf Vein Grids

¹HuiFen Huang, ¹Prof. QingXin Chu, ¹Du Shu, ²JianKang Xiao(¹South China University of Technology, ²Hohai University)

10:00 - 10:15

#39: GPGPU-Based Latency Insertion Method : Application to PDN simulations

Yuta Inoue, Tadatoshi Sekine, Hideki Asai (Shizuoka University)

10:15 - 10:30

#51: Simulated High-Frequency Characteristics of Coaxial Via Connection Structures in Printed Circuit Boards Using Three-Dimensional Electromagnetic Field Analysis

^1,2Yoshiyuki Takasu, ¹Katsuya Kikuchi, ¹Hiroshi Nakagawa, ²Kohji Koshiji, ^1,2Masahiro Aoyagi (¹National Institute of Advanced Industrial Science and Technology, ²Tokyo University of Science)

Modeling II

Session Chair: Prof. Tie Jun Cui (SEU)

Time

Paper Title & Authors

11:15 - 11:45

Invited Paper

#63: Computational Electromagnetics for Multi-Scale Structures in Circuits

^1,2Weng Cho Chew, ³Zhi Guo Qian, ⁴Mao Kun Li (¹The University of Hong Kong, ²University of Illinois, ³Apache Design Solutions, Inc., ⁴Schlumberger-Doll Research Center)

11:45 - 12:00

#20: A Method of Locating Leaky Wave Poles of Spectral Green's Functions for a Layered Medium by Consecutive Frequency Perturbation

Zhe Song, Kai-Lai Zheng, Hou-Xing Zhou, Jun Hu, Wei Hong (Southeast University)

12:00 - 12:15

#21: A New FDTD Algorithm Based on Alternating-Direction Explicit Method

Masaki Unno, Shuichi Aono, Hideki Asai (Shizuoka University)

12:15 - 12:30

#57: Analysis of Frequency-Dependent Lossy Transmission Lines Driven by CMOS Gates

¹Xiaochun Li, ¹Junfa Mao, ²Madhavan Swaminathan (¹Shanghai Jiao Tong University, ²Georgia Institute of Technology)

12:30 - 12:45

#108: Dynamic admittance of carbon nanotube-based molecular electronic devices and their equivalent electric circuit

Guanhua Chen, Chiyung Yam, Xiao Zheng, William A Goddard III (The University of Hong Kong)

Embedded Passives

Session Chair: Prof. Ruey-Beei Wu (NTU)

Time

Paper Title & Authors

13:45 - 14:15

Invited Paper

#100: Theories, Rapid Designs, Experiments, and Applications of Electromagnetic Metamaterials

Tie Jun Cui (Southeast University)

14:15 - 14:30

#17: A New Wide Stopband Microstrip Bandpass Filter with Miniaturized Interdigital Capacitor Resonator

¹Wei Shen, ^1,2Wen-Yan Yin, ³Xiao-Wei Sun, ¹Jun-Fa Mao (Shanghai Jiao Tong University, ²Zhejiang University, ³Chinese Academy of Sciences)

14:30 - 14:45

#30: Filter Integration in Ultra Thin Organic Substrate via 3D Stitched Capacitor

Sunghwan Min, Seunghyun Hwang, Daehyun Chung, Madhavan Swaminathan, Vivek Sridharan, Hunter Chan, Fuhan Liu, Venky Sundaram, Rao R. Tummala (Georgia Institute of Technology)

14:45 - 15:00

#35: A Wide-band Microstrip-to-Microstrip Multi-layered Via Transition Using LTCC Technology

Chih-Chun Tsai, Yung-Shou Cheng, Ting-Yi Huang, Ruey-Beei Wu (National Taiwan University)

15:00 - 15:15

#55: A Low-Cost High-Density Substrate Technology for Wireless-related Applications

Ruonan Wang, Robin Lou, Kevin Cheng, Yeung Yeung, Lydia Leung, Jyh-Rong Lin, Tom Chung (Hong Kong Applied Science and Technology Research Institute)

Packaging

Session Chair: Dr. Hui-li Fu (Huawei)

Time

Paper Title & Authors

15:15 - 15:45

Invited Paper

Integrated Design of Manufacturability and Reliability for Package-on-Package (PoP)

Bin Xie, Daniel Shi, Tom Chung (Hong Kong Applied Science and Technology Research Institute)

15:45 - 16:00

#22: 60-GHz Antenna-in-Package Technology

Yue Ping Zhang (Nanyang Technological University)

16:00 - 16:15

#24: Novel I/O-Bump Design and Optimization for Chip-Package Codesign

Ren-Jie Lee, Hung-Ming Chen (National Chiao Tung University)

16:15 - 16:30

#34: Novel Electrical Modelling and Measurement Technique of Hybrid Package (FusionQuad) For Characterization of RF and High Speed Signals

SeungJae Lee, KiCheol Bae, Jiheon Yu, YoungSuk Chung, ChanHa Hwang, ChoonHeung Lee (Amkor Technology Korea)

16:30 - 16:45

#82: A High Performance Plastic Air-Cavity QFN Solution for Future Potential Microwave Package Large Scale Application

^1,2Liang Wu, ¹Qian Rong, ¹Xiaowei Sun (¹Shanghai Institute of Microsystem and Information Technology, ²Chinese Academy of Science)

Session Chairs: Prof. Wen-yan Yin (ZJU)

Paper Title & Authors

#50: Wideband and Low-Profile Antenna by Using a Unique Direct Feed Approach

Anping Zhao (Nokia Research Center)

#52: Lifetime Assessment on LED Lighting based on Prognostics

¹Gang Niu, ¹Daniel Lau, ^1,2Michael Pecht (¹City University of Hong Kong, ²University of Maryland)

#54: Substrate Integrated High-Q Dielectric Resonators For Low Phase Noise Oscillator

¹Liang Zhou, ²Wen-yan Yin, ¹Jun-Fa Mao (¹Shanghai Jiaotong University, ²Zhejiang University)

#56: Application of Trace Impedance Monitoring on Production Quality Control

Te-Chun Wang, Yin-Guang Zheng (ASE Assembly & Test (Shanghai) Limited)

#58: High-Dynamic-Range Zero-Bias Microwave Detector Using AlGaN/GaN-Based Lateral Field-Effect Diode

¹Qi Zhou, ¹King-Yuen Wong, ^1,2Wanjun Chen, ¹Kevin J. Chen (¹Hong Kong University of Science and Technology, ²University of Electronic Science and Technology of China)

#70: Investigation of the Gyro-resonance Region Modes by Using the MoM for Plasma Column Loaded Cylindrical Waveguide

Ersoy Kelebekler (Kocaeli University)

#81: Analysis of Discontinuity Effects in Development a Fully Integrated Millimeter wave Receiver Front End

^1,2Liang Wu, ^1,2Yang Hou, ¹Rong Qian, ¹Xiaowei Sun (¹Shanghai Institute of Microsystem and Information Technology, ²Chinese Academy of Science)

#99: Simulation of Human Head Exposed to Handset Using Hybrid NFM/MoM Techniques

^{1, 2}Lei Zhao, ¹Ke-Li Wu (¹The Chinese University of Hong Kong, ²Xuzhou Normal University)