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The 2009 EDAPS Symposium :
The Electrical Design of Advanced Packaging & Systems (EDAPS) has been the premier international signal integrity symposium in Asia region since 2002. The symposium consists of paper presentations, industry exhibitions, workshops and tutorials. The 2009 EDAPS will be jointly organized by The Chinese University of Hong Kong, Applied Science and Technology Research Institute (ASTRI), Innovation and Technology Commission of Hong Kong SAR Government and the IEEE Components, Packaging and Manufacturing Technology Society (CPMT).
The purpose of EDPAS Symposium is to enhance the technical awareness and technology collaborations in the Asia region specifically in the electrical designs of chip, package and system levels from design concepts, technical challenges to the modeling and EDA tools. The papers of the symposium not only address the current technical issues but also bring out the challenges facing to IC design, SiP/SoP packaging, EMI/EMC, and EDA tools. The symposium is a major venue for creating the opportunity for the researchers and practitioners from the diverse fields to exchange information and build up the network.
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