2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium

December 2-4, 2009 Hong Kong/ShenZhen, China

Online Registration

Title:  Mr.  Mrs.  Ms.  Prof.  Dr.

Function at Conference: Delegate  Student  Invited speaker  Committee member

First name:

Middle name:

Last (Family) name:

Email address:

Organization:

Postal address:

Country:

Tel: (country code - area code - tel no.)

Fax: (country code - area code - tel no.)

IEEE Membership:

¡@

Program attending: (Please tick your choices):
Power integrity
Mobile Phone & Related Topics
Packaging & EMI

¡@

Conference Fee:
USD 480 (IEEE member)
UDS 600 (Non-IEEE member)
USD 180 (Student)
Onsite Payment
Will NOT attend Conference
Registration Fee includes: One copy of abstract book and CD, all technical sessions, banquet, official tours and lunch (3-4,Dec 2009)

¡@

Tutorial Fee:
USD 144 (IEEE member)
USD 180 (Non-IEEE member)
USD 90 (Student)
Onsite Payment
Will NOT attend Tutorial
Tutorial Fee includes: Lunch (2,Dec 2009)

¡@